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High-Performance Polymers Volume 3

Guy Rabilloud

576 pages
Editions Technip
The basic purpose of this book is to consider the present status of polyimides in the electronic industry in order to provide an overview of the polymers used for optical lithography, semiconductor encapsulation, packaging, flexible circuitry, and conformal coatings. Contents: 1. Polymers for electronic applications. 2. Polyimides developed for electronic applications. 3. Structure-property relationships. 4. Negative and positive photosensitive polyimides. 5. Spin coating process and modelling. 6. Planarization properties of polyimide films. 7. Alignment layers for liquid crystal displays. 8. Multichip modules and other applications